หัวแร้งปรับอุณหภูมิ Aoyue 2901 แบบลีดฟรี

Power is 70W.

         220V/110V power supply can be replaced.

  Packing list: 2901 host, B010 Lead iron pen, 30150J heat pads, 2630 Iron Stand, power cord

SPECIFICATIONS Specifications

  Power supply voltage: 110V / 220V switching power

  Output voltage: 24V

  Power consumption: 70W

  Temperature range: 250 ° C-480 ° C

  Heating element: Ceramic heater

  Tip Ground Resistance: 2 W the following

  Tip ground potential: 2mV the following

  Volume: 110 (W) x 90 (high) x 155 (depth) mm

  Gross Weight: 2.5 Kg

ราคา 2500 บาท

ขาย วอร์มบอร์ด Aoyue 853A

 

The Pre Heater is used as a base on which the PCB is placed and kept in place with the help of small magnetic foot. It can also preheat the PCB up to a suitable temperature from the lower side.

Information

Temperature range

98°C - 380°C

Power

220V/50Hz＋－10％ 110V/60Hz＋－10％

Machine dimensions

220*247*73 mm

Heating surface

130*130 mm

Power consumption

600 W

Package Contains :

• 1 x Preheating station
• 1 x Circuit board holder
• 1 x Power cord
• 1 x Instruction manual 

ราคา 3,500 บาท 

เครื่องยกชิพ BGA REWORK SP360

SP360 BGA Rework Station
SP360 BGA rework station produces high-tem breeze, precisely controlling the soldering and desoldering process. With movable heating head, able to move horizontally; easy to operate. There is equipped with different hot gas nozzles, easy to replace; can be customized according to specific needs.
SP360 Features：

• High quality heating material produces high-tem breeze, precisely controlling the soldering and desoldering process.
• Movable heating head, able to move horizontally; easy to operate;
• Hot air below and above, can set temperatures independently; IR constant temperature heat
• 8 temperature settings above, can save for 10 settings. temperature settings below as above.
• Alarm and protection function for temperature-over.
• The temperatures of the upper and lower heater can be precisely controlled according to set temperatures; bottom constant temperature infrared heating area; appropriate temperature control apparatus can ensure safe rework for BGA;
• The BGA soldering supporting frame can micro-adjusted to avoid local sinkage;
• Powerful cross flow can cool the lower heating area;
• The adjustable PCB positioning supports, easy and fast to install PCB; special fixture for installing allotype boards ;
• with sound alarming function after finishing soldering or desoldering; hand vacuum pen easy for picking up BGA;
• Set with over temperature alarming and protection function;
• Equipped with different hot gas nozzles, easy to replace; can be customized according to specific needs;
• The integrated design of machine and chassis is room-saving.

SP360 Specifications：

Suit for PCB	50x50-430x350 mm
Suit for chip
Max dimension	55x55 mm
Mini dimension	7x7 mm
Max weight	80g
Power for operation	400w
Main heater	800w
Lower heater	800w
Bottom heater	IR 2400w
Power consumption	4000w
Dimension	620x580x650 mm
Weight	33 kg
Power for requirement	AC 220V, 50/60 Hz

เครื่องยกชิพ BGA REWORK XDF-D

1 . Total Power: 5200W

    2 . Upper Heating: 800W

    3 . Lower heating: 1200W

 4 . Preheat the bottom of the IR: 3000W

    5 . Current: AC220V  50/60HZ

    6 . Dimensions: L 710mm ⅹ W680mm ⅹ H660mm

    7 . Minimum PCB size: 40mm ⅹ 40mm

    8 . Maximum PCB size: 450mm ⅹ 400mm

Second, the special  points :

1. By PLC , touch screen human-machine interface dialogue control;

   2. Three separate temperature zone temperature control, heating control more accurate;

   3. The first zone, second temperature zone heater with good heating material, can accurately adjust the hot air flow and temperature, resulting in high-temperature wind, the third temperature by far-infrared heating panels warm;

   4. The first zone, second temperature, third temperature to 9, paragraph l ( down) +9 segment temperature control, can store 100 groups temperature curve;

   5. The first zone, second temperature zone over-temperature protection design;

   6. In the demolition, welding after the constant flow using a large fan on the PCB board to cool, to prevent the PCB board deformation ensure welding effect;

   7. The first heater temperature can be around, up and down adjustment and 360 degree rotation, easy to operate;                   8. The second temperature zone can be based on different PCB board appearance, adjust up and down components of different heights, to prevent collision with the board bottom component;

   9. The third temperature zone can move around for maintenance of a large PCB , CBGA and PCB board BGA side edge ;

   10. With a variety of sizes of hot air nozzle, or customized according to special requirements; hot air nozzle can be 360 degree rotation, easy to replace ;

   11.V-based slot designed to prevent collisions with the component;

   12. Adjustable high temperature PCB bracket, positioning the rack protection against hot design;

   13.BGA demolition, after welding with a voice alarm function;

   14. Hand-held vacuum wand to take away BGA , convenient, reliable and durable;

   15. Random folder with the opposite sex, for different shapes laptop PCB board maintenance.

เครื่องยกชิพ BGA REWORK XDF-A

the main specifications and technical parameters 3000W Number:

1. The total   power   rate: 3000W-3200W

2. Upper Heating power: 600W

3. the bottom of the heating power: 2400W

4. Power supply: Single phase 220V/230V   50/60Hz   3.2KVA

5. Overall dimensions: the body parts of 450 × 400 × 580mm

6 . Temperature control: high-precision K -type thermocouple

7 . Positioning: V shaped slot PCB positioning, the biggest meet PCB size of 280 × 320mm

8 . Weight: about 25kg

Second, the special  points:

1. using high-precision original accessories (temperature meters, relays, heaters) precise control of BGA of the desoldering process.

2. the upper and lower independent heating temperature, which can set the 8- segment heating +8 section of constant temperature control, can also store 10 groups or more temperature settings.

3. selection of imported high-precision thermocouples, to achieve the precise temperature detection.

4. by top heating and bottom heating temperature curve to go alone way to ensure that PCB in the welding process, not deformed.

5. equipped with manual vacuum suction pen for easy dismantling after welding sucked BGA .

6.PCB positioning with V shaped slot, flexible and convenient removable fixture on the PCB has protective effects.

7. For large thermal capacity of PCB and other high temperature requirements of lead-free soldering and so can easily handle

8. Heating complete with music prompts.