Thursday, 3 February 2011

เครื่องยกชิพ BGA REWORK SP360








SP360 BGA Rework Station
SP360 BGA rework station produces high-tem breeze, precisely controlling the soldering and desoldering process. With movable heating head, able to move horizontally; easy to operate. There is equipped with different hot gas nozzles, easy to replace; can be customized according to specific needs.
SP360 Features:
  • High quality heating material produces high-tem breeze, precisely controlling the soldering and desoldering process.
  • Movable heating head, able to move horizontally; easy to operate;
  • Hot air below and above, can set temperatures independently; IR constant temperature heat
  • 8 temperature settings above, can save for 10 settings. temperature settings below as above.
  • Alarm and protection function for temperature-over.
  • The temperatures of the upper and lower heater can be precisely controlled according to set temperatures; bottom constant temperature infrared heating area; appropriate temperature control apparatus can ensure safe rework for BGA;
  • The BGA soldering supporting frame can micro-adjusted to avoid local sinkage;
  • Powerful cross flow can cool the lower heating area;
  • The adjustable PCB positioning supports, easy and fast to install PCB; special fixture for installing allotype boards ;
  • with sound alarming function after finishing soldering or desoldering; hand vacuum pen easy for picking up BGA;
  • Set with over temperature alarming and protection function;
  • Equipped with different hot gas nozzles, easy to replace; can be customized according to specific needs;
  • The integrated design of machine and chassis is room-saving.
SP360 Specifications:
Suit for PCB 50x50-430x350 mm
Suit for chip 
Max dimension 55x55 mm
Mini dimension 7x7 mm
Max weight 80g
Power for operation 400w
Main heater 800w
Lower heater 800w
Bottom heater IR 2400w
Power consumption 4000w
Dimension 620x580x650 mm
Weight 33 kg
Power for requirement AC 220V, 50/60 Hz